36x36mm Multi Chip Module (MCM / MCU) with lid removed.
Not alot known about these, the base is coverered in gold pins,
and the top of this one has two large chips face down on contacts.
Any more info would be appreciated.

36x36mm Multi Chip Module (MCM / MCU) Top side
1897415
IBM 22
1 418 2565

Larger 50x50mm Multi Chip Module (MCM / MCU) Top side 6369186
IBM 34
1 736 5469

50x50mm Multi Chip Module (MCM / MCU) Under side
only markings in gold on bottom are:
4141932
88434221

50x50mm Multi Chip Module (MCM / MCU) Top side
Sealed ceramic top, with silicone heatsink paste as seen.

106x106mm Multi Chip Module (MCM / MCU) Top side
Sealed ceramic top, with grooves as seen, huge heatsink fits to top.
In gold on bottom: (HITACHI symbol) J22-0 41X-0 440
3X1842001 XH133- BD REV - 0

106x106mm Multi Chip Module (MCM / MCU) Under side
Whats inside !?! I opened one up - more pictures coming soon, of the 16 interesting chips, and individual thermal transfer system inside

118x111mm Multi Chip Module (MCM / MCU) Top side
Multiple chips face down on contacts, some left off from production. Was encased in heavy heatsink.
In gold on Top Side is printed only:
R455 4281 and there is a tiny glass bead (temperature/moisture/humidity) sensor on the edge of the chips.

118x111mm Multi Chip Module (MCM / MCU) Under side

114x106mm Multi Chip Module (MCM / MCU) Top side
Multiple chips face down on contacts. Very heavy, and based on a thick gold frame
In gold on Top Side is printed only:
56132 71 and 82514 168

114x106mm Multi Chip Module (MCM / MCU) Under side
Very heavy, and based on a thick gold frame
Nothing printed on bottom. In gold on Top Side is printed only:
56132 71 and 82514 168

145x145mm Multi Chip Module (MCM / MCU) in heatsink holder - Under side Very heavy, and encased in HUGE heatsink.

145x145mm Multi Chip Module (MCM / MCU) in heatsink holder - Top side
Very heavy, and encased in HUGE heatsink. Large cooling fins 120mm high bolted to the top of this as well, and there are rows upon rows of these in a unit !